Máy chủ HPE ProLiant DL360 Gen10 Plus 

The HPE ProLiant DL360 Gen10 Plus server supports the 3rd Generation Intel® Xeon® Scalable Processors with up to 40 cores, plus 3200 MT/s HPE DDR4 SmartMemory up to 4.0 TB per socket. Introducing PCIe Gen4 and Intel® Software Guard Extensions (SGX) support on the dual-socket segment, the HPE ProLiant DL360 Gen10 Plus server complements Gen10 reach by delivering premium compute, memory, I/O, and security capabilities for customers focused on performance at any cost.

Notes: Systems Insight Display (SID) module will include #8-12 above (will not include #13 – iLO Service Port).

Notes: ¹This option will lose iLO Service Port.

Rear View – Standard for all DL360 Gen10 Plus

· Mellanox MCX6134 10/25GbE 2-port OCP Adapter and MCX631102 10/25GbE 2-port PCIe Adapter

· HPE SAS 24G Mixed Use Multi Vendor SSDs (800GB/1.6TB/3.2TB/6.4TB)

· HPE SAS 24G Read Intensive Multi Vendor SSDs (960GB/1.92TB/3.84TB/7.68TB/15.36TB)

· HPE 7.68TB SAS 24G Read Intensive LFF LPC Multi Vendor SSD

· HPE SATA 6G Mixed Use PM897 SSDs (480GB/960GB/1.92TB)

· HPE SATA 6G Read Intensive PM893 SSDs (480GB/960GB/1.92TB/3.84TB)

· HPE StoreEver LTO-9 Ultrium 45000 External Tape Drive

Form Factor

· 1U rack

Chassis Types

· 8 SFF with options for aditional 2 SFF drive bays: 12G x1 SAS/SATA, 24G x4 Tri-Mode or 16G x4 NVMe

· 4 LFF

System Fans

· Single rotor hot plug fans by default

Notes:

– Optional High Performance Fan Kit available (includes 7 fans).

Notes:

– The 2nd digit of the processor model number “x3xx” is used to denote the processor generation (i.e. 3 = 3rd generation).

– This table covers the public Intel offering only.

– For more information regarding Intel Xeon processors, please see the following http://www.intel.com/xeon.

Notes:

– 4.0TB maximum RAM per socket.

– 64 PCIe 4.0 lanes.

– 1.5 MB L3 cache/core, except on 6354 and 6346 processors (2.16 and 2.25 MB L3/core respectively).

– “U” processors (i.e. 6314U, 6312U) only supported in single socket configurations.

– Intel SST-CP (Core Power)- Enables flexibility for workloads that benefit from higher base frequency on a subset of the processor’s cores. While the max turbo frequency across the cores remain constant across the cores, a subset of the cores can be assigned as to run at a higher base frequency than specified, while the other cores run at lower base frequency.

– Intel SST-TF (Turbo Frequency)- Enables flexibility for workloads that benefit from higher turbo frequency on a subset of the processor’s cores. While the base frequency remains constant across the cores, a subset of the cores can be assigned to run at a higher turbo frequency than specified, while the other cores run at lower turbo frequency.

– Intel SST-BF (Base Frequency)- Allows the configuration of a guaranteed higher base frequency, for a specific number of cores, to support those workloads and applications that are not optimized for turbo frequencies.

– Intel Speed select SST-BF, SST-TF, SST-CP supported on Gold and Platinum processors. Power Profile (SST-PP) suppported on Y, and select V, S and N processors.

Notes:

– 8-Channel DDR4 @ 3200 MT/s (lower DDR4 speed may be used in segment optimized processors (i.e. Cloud, NFV, etc).

– Support for Intel Optane Persistent Memory 200 Series, enabling up to 6TB memory per socket (does not work with SGX).

– 2 socket capable, 3 UPI @ 11.2 GT/s.

– Advanced RAS (except 8358P), AVX-512 2 FMA, SGX 64GB, TME-MT 64 keys.

– ¹Deterministic base frequency rating only applicable to VM workloads. Other workloads may see throttling.

– ²Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– ³Single socket capable even though not being a “U” processor. No dual socket support.

– ⁴Default Speed Select Performance Profile value.

– ⁵Does not support Sub-NUMA 2 (SNC2).

– ⁶Does not support Intel Speed Select Technology – Base Frequency (SST-BF).

Notes:

– 8-channel DDR4 @ 3200 MT/s (lower DDR4 speed may be used in segment optimized processors (i.e. NFV, etc).

– Support for Intel Optane Persistent Memory 200 Series, enabling up to 6TB memory per socket (does not work with SGX).

– 2 sockets capable, 3 UPI @ 11.2 GT/s.

– Advanced RAS, AVX-512 2 FMA, SGX 64GB, TME-MT 64 keys.

– ¹Deterministic base frequency rating only applicable for NFV workloads. Other workloads may see throttling.

– ²Single socket capable, no dual socket support

– ³Default Speed Select Performance Profile value.

Notes:

– 8-channel DDR4 @ 2933 MT/s (lower DDR4 speed may be used in segment optimized processors (i.e. NFV, etc).

– Support for Intel Optane Persistent Memory 200 Series, enabling up to 6TB memory per socket (does not work with SGX).

– 2 sockets capable, 3 UPI @ 11.2 GT/s.

– Advanced RAS, AVX-512 2 FMA, SGX 64GB, TME-MT 64 keys.

– ¹Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– ²Deterministic base frequency rating only applicable for NFV workloads. Other workloads may see throttling.

– ³Default Speed Select Performance Profile value.

Notes:

– 8-channel DDR4 @ 2667 MT/s.

– 2 sockets capable, 2 UPI @ 10.4 GT/s.

– Standard RAS, AVX-512 2 FMA, SGX 8GB, TME-MT 64 keys.

– ¹Supports Intel Optane Persistent Memory 200 Series, enabling up to 6TB memory per socket (does not work with SGX).

– ²Default Speed Select Performance Profile value.

Intel C621A Chipset

Notes: For more information regarding Intel® chipsets, please see the following URL: https://www.intel.com/content/www/us/en/products/chipsets/server-chipsets.html

HPE iLO 5 ASIC

Notes: Read and learn more in the iLO QuickSpecs.

– All processors support up to 6TB memory per socket.

– Mixing of RDIMM and LRDIMM memory is not supported.

– To realize the performance memory capabilities listed in this document, HPE DDR4 SmartMemory is required.

– For additional information, please see the HPE DDR4 SmartMemory QuickSpecs.

– Intel Persistent Memory 200 series only supported on Gold and Platinum Processors.

– For General Server Memory and Persistent Memory Population Rules and Guidelines for Gen10 Plus see details here: http://www.hpe.com/docs/memory-population-rules

Advanced ECC

Advanced ECC uses single device data correction to detect and correct single and all multibit error that occurs within a single DRAM chip.

Online Spare

Memory online spare mode detects a rank that is degrading and switches operation to the spare rank.

Notes: For more information see our Memory RAS feature technical whitepaper.

Notes: The specifications above correspond with the default primary riser.

Notes:

­  Does not include M.2 media, 22110 capable.

­  Requires high performance fan kit (P26477-B21).

Notes: Requires high performance fan kit (P26477-B21).

· Optical Drive

Available on 8 SFF and 4 LFF CTO Servers as an option (DVD-ROM or DVD-RW)

· Hard Drives

None ship standard

NVMe Boot Devices

· HPE DL36X Gen10 Plus x16/x8 M.2 NS204i-r Riser

· HPE NS204i-p NVMe PCIe3 OS Boot Device

· HPE Smart Storage SR100i SR Gen10 Plus SW RAID

Notes:

– All models feature an embedded storage controller, capable of operating on AHCI or SR100i modes, with embedded software supporting RAID for either up to 14 SATA drives or 2 NVMe SSDs. In addition, all models feature 2 x8 PCIe 4.0 connectors per socket for NVMe SSDs, which must be used on SR100i mode. NVMe SSDs are qualified on SFF models only.

– HPE Smart Storage SR100i SR Gen10 Plus SW RAID will operate in UEFI mode only. For legacy support an additional controller will be needed, and for CTO orders please also select Legacy mode setting (758959-B22).

– HPE Smart Storage SR100i SR Gen10 Plus SW RAID is off by default and must be enabled.

– Supports Microsoft Windows Server only.

– For Linux users, HPE offers a solution that uses in-distro open-source software to create a two-disk RAID 1 boot volume. For more information visit: https://downloads.linux.hpe.com/SDR/project/lsrrb/

· Intel VROC NVMe for HPE ProLiant Gen10 Plus

Notes:

– All models feature 2 x8 PCIe 4.0 connectors per socket for NVMe connectivity. On 2P configurations, these provide support for up to 8 direct attach NVMe bays. Options available to connect 2 additional bays.

– Only supported on SFF models.

– Intel VROC for HPE ProLiant Gen10 Plus is an enterprise, hybrid Software RAID solution specifically designed for NVMe SSDs connected directly to the CPU. Intel VROC is a software-based solution utilizing Intel CPU to RAID or HBA direct connected drives and supports both Intel® SFF SSDs and HPE SFF SSDs.

– RAID Support- 0/1/5/10.

– Windows, Linux, VMware OS support.

– Host Tools- Windows GUI/CLI, Linux CLI.

– UEFI Support- HII Utility, OBSE.

– Active health monitoring of NVMe M.2 drives requires use of SMART tools.

– Intel VROC NVMe for HPE ProLiant Gen10 Plus will operate in UEFI mode only. For legacy support an additional Tri-Mode controller will be needed, and for CTO orders please also select Legacy mode setting (758959-B22).

– For NVMe SSDs only, no PCIe card support.

– Intel VROC NVMe is off by default and requires licensing, see options for details.

· Intel Intel VROC SATA for HPE ProLiant Gen10 Plus

Notes:

– All models feature an embedded storage controller, with embedded software SATA RAID support for up to 14 bays.

– Intel VROC for HPE ProLiant Gen10 Plus is an enterprise, hybrid Software RAID solution specifically designed for SSDs. Intel VROC is a software-based solution utilizing Intel CPU to RAID or HBA direct connected drives and supports both Intel® SFF SSDs and HPE SFF SSDs.

– RAID Support- 0/1/5/10.

– Windows and Linux OS support.

– Host Tools- Windows GUI/CLI, Linux CLI.

– UEFI Support- HII Utility, OBSE.

– iLO Support- IML, Alert, SNMP, AHS.

– iLO Redfish- Redfish Read .

– ** Requires AMS & iLO 2.42.

– Intel VROC SATA for HPE ProLiant Gen10 Plus will operate in UEFI mode only. For legacy support an additional storage controller will be needed, and for CTO orders please also select Legacy mode setting (758959-B22).

– Intel VROC SATA is off by default and must be enabled.

Essential RAID Controllers

· Broadcom MR216i-a Tri-Mode Controller for HPE Gen10 Plus

· Broadcom MR216i-p Tri-Mode Controller for HPE Gen10 Plus

· HPE Smart Array E208i-a SR Gen10 Controller

· HPE Smart Array E208i-a SR G10 LH Controller

· HPE Smart Array E208i-p SR Gen10 Controller

· HPE Smart Array E208e-p SR Gen10 Controller

Performance RAID Controllers

· Microchip SR932i-p Tri-Mode Controller for HPE Gen10 Plus

· Microchip SR416i-a Tri-Mode Controller for HPE Gen10 Plus

· Broadcom MR416i-p Tri-Mode Controller for HPE Gen10 Plus

· Broadcom MR416i-a Tri-Mode Controller for HPE Gen10 Plus

· HPE Smart Array P408i-a SR Gen10 Controller

· HPE Smart Array P408i-a SR G10 LH Controller

· HPE Smart Array P408i-p SR Gen10 Controller

· HPE Smart Array P408e-p SR Gen10 Controller

· HPE Smart Array P816i-a SR Gen10 Controller

· HPE Smart Array P816i-a SR G10 LH Controller

Notes:

– If an accelerator needs to be installed on slots 2 or 3, then an LH storage controller (low profile heatsink) should be ordered to allow it to fit in the server.

– For additional details, please see HPE Smart Array Gen10 Controllers Data Sheet.

· Integrated video standard

· Video modes up to 1920 x 1200 @ 60 Hz (32 bpp)

· 16 MB Video Memory

· HPE iLO 5 on system management memory

· 32 MB Flash

· 4 Gbit DDR3 with ECC protection

· HPE 500W Flex Slot Platinum Hot Plug Low Halogen Power Supply Kit

Notes: Available in 94% efficiency.

· HPE 800W Flex Slot Platinum Hot Plug Low Halogen Power Supply Kit

Notes:

– Available in 94% and 96% efficiency.

– Also available in -48VDC and 227VAC/380VDC power inputs.

· HPE 1600W Flex Slot Platinum Hot Plug Low Halogen Power Supply Kit

Notes:

– Available in 94% efficiency.

– 1600W Power supplies only support high line voltage (200 VAC to 240 VAC).

HPE Flexible Slot (Flex Slot) Power Supplies share a common electrical and physical design that allows for hot plug, tool-less installation into HPE ProLiant Gen10 Plus Performance Servers. Flex Slot power supplies are certified for high-efficiency operation and offer multiple power output options, allowing users to “right-size” a power supply for specific server configurations. This flexibility helps to reduce power waste, lower overall energy costs, and avoid “trapped” power capacity in the data center.

All pre-configured servers ship with a standard 6-foot IEC C-13/C-14 jumper cord (A0K02A). This jumper cord is also included with each standard AC power supply option kit. If a different power cord is required, please check the ProLiant Power Cables web page.

To review the power requirements for your selected system, please use the HPE Power Advisor Tool.

For information on power specifications and technical content visit HPE Server power supplies.

· Windows Server 2019: Essentials, Standard, Datacenter

· Windows Server 2022: Essentials, Standard, Datacenter

· Microsoft Hyper-V Server: 2016, 2019 & 2022

· VMware vSphere: 6.7 U3 w /P03, 7.0 U2

· Red Hat Enterprise Linux (RHEL): 7.9, 8.2 (64 bit, includes KVM)

· SUSE Linux Enterprise Server (SLES): 12 SP5, 15 SP2 (64 bit, includes KVM & Xen) **

· Canonical Ubuntu: 20.04 LTS (64 bit)

· Oracle Linux: 7.9, 8.2

· Citrix: Hypervisor: 8.2 LTSR

Notes: For more information on Hewlett Packard Enterprise Certified and Supported ProLiant Servers for OS and Virtualization Software and latest listing of software drivers available for your server visit http://www.hpe.com/info/ossupport

· ACPI 6.3 Compliant

· PCIe 4.0 Compliant

· WOL Support

· Microsoft® Logo certifications

· PXE Support

· USB 3.0 Compliant

· USB 2.0 Compliant (only on optional Universal Media Bay)

· SMBIOS 3.2

· Redfish API

· IPMI 2.0

· Secure Digital 4.0

· TPM 1.2 and 2.0 support

· Advanced Encryption Standard (AES)

· Triple Data Encryption Standard (3DES)

· SNMP v3

· TLS 1.2

· DMTF Systems Management Architecture for Server Hardware Command Line (SMASH CLP)

· Active Directory v1.0

· ASHRAE A3/A4

Notes: For additional technical, thermal details regarding ambient temperature, humidity, and feature support, please visit http://www.hpe.com/servers/ashrae

· EU Lot9

Notes: European Union (EU) eco-design regulations for server and storage products, known as Lot 9, establishes power thresholds for idle state, as well as efficiency and performance in active state which vary among configurations. HPE ProLiant Gen10 Plus servers are compliant with Lot9 requirements.

Please visit: https://www.hpe.com/us/en/about/environment/msds-specs-more.html for more information regarding HPE Lot 9 conformance.

· UEFI (Unified Extensible Firmware Interface Forum) 2.6

Notes: UEFI is the default for the DL360 Gen10 Plus. Legacy mode can be selected in the field or as a factory option (758959-B22); some configuration restrictions apply.

Unified Extensible Firmware Interface (UEFI) is an industry standard that provides better manageability and more secured configuration than the legacy ROM while interacting with your server at boot time. HPE ProLiant Gen10 Plus servers have a UEFI Class 2 implementation and support both UEFI Mode (default) and Legacy BIOS Mode.

Notes: The UEFI System Utilities tool is analogous to the HPE ROM-Based Setup Utility (RBSU) of legacy BIOS. For more information, please visit http://www.hpe.com/servers/uefi.

UEFI enables numerous new capabilities specific to HPE ProLiant servers such as:

· Secure Boot and Secure Start enable for enhanced security

· Operating system specific functionality

· Support for > 2.2 TB (using GPT) boot drives

· USB 3.0 Stack

· Embedded UEFI Shell

· Mass Configuration Deployment Tool using iLO RESTful API that is Redfish API Conformant

· PXE boot support for IPv6 networks

· Workload Profiles for simple performance optimization

UEFI Boot Mode only:

· TPM 2.0 Support

· NVMe Boot Support

· Platform Trust Technology (PTT) can be enabled.

· iSCSI Software Initiator Support.

· HTTP/HTTPs Boot support as a PXE alternative.

· Boot support for option cards that only support a UEFI option ROM

Notes:

– For UEFI Boot Mode, boot environment and OS image installations should be configured properly to support UEFI.

– UEFI FIO Setting (758959-B22) can be selected to configure the system in Legacy mode in the factory for your HPE ProLiant Gen10 Plus Server.

HPE Integrated Lights-Out (HPE iLO)

Monitor your servers for ongoing management, service alerting, reporting and remote management with HPE iLO.

Learn more at http://www.hpe.com/info/ilo.

Configure and boot your servers securely with industry standard Unified Extensible Firmware Interface (UEFI).

Learn more at http://www.hpe.com/servers/uefi.

Hassle free server and OS provisioning for one or more servers with Intelligent Provisioning.

Learn more at http://www.hpe.com/servers/intelligentprovisioning.

iLO RESTful API is Redfish API conformance and offers simplified server management automation such as configuration and maintenance tasks based on modern industry standards. Learn more at http://www.hpe.com/info/restfulapi.

Active Health System

The HPE Active Health System (AHS) is an essential component of the iLO management portfolio that provides continuous, proactive health monitoring of HPE servers. Learn more at http://www.hpe.com/servers/ahs.

Use the Active Health System Viewer, a web-based portal, to easily read AHS logs and speed problem resolution with HPE self-repair recommendations, to learn more visit: http://www.hpe.com/servers/ahsv.

Keep your servers up to date with the HPE Smart Update solution by using Smart Update Manager (SUM) to optimize the firmware and driver updates of the Service Pack for ProLiant (SPP).

Learn more at https://www.hpe.com/us/en/servers/smart-update.html.

Designed for large enterprise and service provider environments with hundreds of HPE servers, the iLO Amplifier Pack is a free, downloadable open virtual application (OVA) that delivers the power to discover, inventory and update Gen8, Gen9, Gen10 and Gen10 Plus HPE servers at unmatched speed and scale. Use with an iLO Advanced License to unlock full capabilities.

Learn more at http://www.hpe.com/servers/iLOamplifierpack.

Enables the ability to access, deploy, and manage your server anytime from anywhere from select smartphones and mobile devices. For additional information please visit: http://www.hpe.com/info/ilo/mobileapp.

RESTful Interface tool (iLOREST) is a single scripting tool to provision using iLO RESTful API to discover and deploy servers at scale. Learn more at http://www.hpe.com/info/resttool.

Provision one to many servers using your own scripts to discover and deploy with Scripting Tool (STK) for Windows and Linux or Scripting Tools for Windows PowerShell.

Learn more at http://www.hpe.com/servers/stk and http://www.hpe.com/servers/powershell.

HPE OneView Standard can be used for inventory, health monitoring, alerting, and reporting without additional fees. It can monitor multiple HPE server generations. The user interface is similar to the HPE OneView Advanced version, but the software-defined functionality is not available. Learn more at http://www.hpe.com/info/oneview.

Ideal for environments already using HPE SIM, it allows you to monitor the health of your HPE ProLiant Servers and HPE Integrity Servers. Also provides you with basic support for non-HPE servers. HPE SIM also integrates with Smart Update Manager to provide quick and seamless firmware updates. Learn more at http://www.hpe.com/info/hpesim.

· UEFI Secure Boot and Secure Start support

· Immutable Silicon Root of Trust

· FIPS 140-2 validation

· Common Criteria certification

· Configurable for PCI DSS compliance

· Advanced Encryption Standard (AES) and Triple Data Encryption Standard (3DES) on browser

· Support for Commercial National Security Algorithms (CNSA)

· iLO Security Modes

· Granular control over iLO interfaces

· Smart card (PIV/CAC) and Kerberos based 2-factor Authentication

· Tamper-free updates – components digitally signed and verified

· Secure Recovery – recover critical firmware to known good state on detection of compromised FW

· Ability to rollback firmware

· Secure erase of NAND

· TPM (Trusted Platform Module)

· Bezel Locking Kit

· Chassis Intrusion detection option

HPE Trusted Platform Module 2.0 is included on Pre-Configured models and can be enabled and disabled using the BIOS.

Notes:The TPM (Trusted Platform Module) is a microcontroller chip that can securely store artifacts used to authenticate the server platform. These artifacts can include passwords, certificates and encryption keys.

This product is covered by a global limited warranty and supported by HPE Services and a worldwide network of Hewlett Packard Enterprise Authorized Channel Partners resellers. Hardware diagnostic support and repair is available for three years from date of purchase. Support for software and initial setup is available for 90 days from date of purchase. Enhancements to warranty services are available through HPE Pointnext operational services or customized service agreements. Hard drives have either a one year or three year warranty; refer to the specific hard drive QuickSpecs for details.

Notes: Server Warranty includes 3-Year Parts, 3-Year Labor, 3-Year Onsite support with next business day response. Warranty repairs may be accomplished through the use of Customer Self Repair (CSR) parts. These parts fall into two categories: 1) Mandatory CSR parts are designed for easy replacement. A travel and labor charge will result when customers decline to replace a Mandatory CSR part; 2) Optional CSR parts are also designed for easy replacement but may involve added complexity. Customers may choose to have Hewlett Packard Enterprise replace Optional CSR parts at no charge. Additional information regarding worldwide limited warranty and technical support is available at:

http://h17007.www1.hpe.com/us/en/enterprise/servers/warranty/.

HPE iLO Advanced

HPE iLO Advanced licenses offer smart remote functionality without compromise, for all HPE ProLiant servers. The license includes the full integrated remote console, virtual keyboard, video, and mouse (KVM), multi-user collaboration, console record and replay, and GUI-based and scripted virtual media and virtual folders. You can also activate the enhanced security and power management functionality. Learn more about HPE iLO Advanced at http://www.hpe.com/servers/iloadvanced.

HPE OneView brings a new level of automation to infrastructure management by taking a template driven approach to provisioning, updating, and integrating compute, storage, and networking infrastructure. It provides full-featured licenses which can be purchased for managing Gen8, Gen9, Gen10 and Gen10 Plus servers. To learn more visit http://www.hpe.com/info/oneview.

HPE InfoSight for Servers combines the cloud-based machine learning of InfoSight with the health and performance monitoring of Active Health System (AHS) and iLO to optimize performance and predict and prevent problems. The end result is an intelligent environment that modernizes IT operations and enhances the support experience by predicting and preventing the infrastructure issues that lead to application disruptions, wasted IT staff time and missed business opportunities.

Learn more at https://www.hpe.com/servers/infosight

HPE Insight Cluster Management Utility is a HyperScale management framework that includes software for the centralized provisioning, management and monitoring of nodes and infrastructure. Learn more at http://www.hpe.com/info/cmu.

Hewlett Packard Enterprise supports various accelerators on select HPE Proliant servers to support different workloads. The accelerators enable seamless integration of GPU computing with HPE ProLiant servers for high-performance computing, large data center graphics, deep learning and virtual desktop deployments. These accelerators deliver all of the standard benefits of GPU computing while enabling maximum reliability and tight integration with system monitoring and management tools such as HPE Insight Cluster Management Utility.

The story may end with servers, but it starts with the foundation that makes compute go – and business grow. We’ve reinvented our entire portfolio of rack and power products to make IT infrastructure more secure, more practical, and more efficient. In other words, we’ve created a stronger, smarter, and simpler infrastructure to help you get the most out of your IT equipment. As an industry leader, Hewlett Packard Enterprise is uniquely positioned to address the key concerns of power, cooling, cable management and system access.

HPE G2 Advanced and Enterprise Racks are perfect for the server room or today’s modern data center with enhanced airflow and thermal management, flexible cable management, and a 10 year Warranty to support higher density computing.

HPE G2 PDUs offer reliable power in flexible form factors that operate at temperatures up to 60°, include color-coded outlets and load segments and a low-profile design for optimal access to the rack and support for dense rack environments.

HPE Uninterruptible Power Systems are cost-effective power protection for any type workload. Some UPSs include options for remote management and extended runtime modules so you’re critical dense data center is covered in power outages.

HPE KVM Solutions include a console and switches designed to work with your server and IT equipment reliably. We’ve got a cost-effective KVM switch for your first rack and multiple connection IP switches with remote management and security capabilities to keep your data center rack up and running.

Learn more about HPE Racks, KVM, PDUs and UPSs at HPE Rack and Power Infrastructure.

SCE is a guided self-service tool to help sales and non-technical people provide customers with initial configurations in 3 to 5 minutes. You may then send the configuration on for configuration help, or use in your existing ordering processes. If you require “custom” rack configuration or configuration for products not available in SCE, please contact Hewlett Packard Enterprise Customer Business Center or an Authorized Partner for assistance https://h22174.www2.hpe.com/SimplifiedConfig/Welcome#

Get the most from your HPE Products. Get the expertise you need at every step of your IT journey with HPE Pointnext Services. We help you lower your risks and overall costs using automation and methodologies that have been tested and refined by HPE experts through thousands of deployments globally. HPE Pointnext Advisory Services, focus on your business outcomes and goals, partnering with you to design your transformation and build a roadmap tuned to your unique challenges.  Our Professional and Operational Services can be leveraged to speed up time-to-production, boost performance and accelerate your business. HPE Pointnext specializes in flawless and on-time implementation, on-budget execution, and creative configurations that get the most out of software and hardware alike.

Consume IT on your terms

HPE GreenLake brings the cloud experience directly to your apps and data wherever they are—the edge, colocations, or your data center. It delivers cloud services for on-premises IT infrastructure specifically tailored to your most demanding workloads. With a pay-per-use, scalable, point-and-click self-service experience that is managed for you, HPE GreenLake accelerates digital transformation in a distributed, edge-to-cloud world.

• Get faster time to market
• Save on TCO, align costs to business
• Scale quickly, meet unpredictable demand
• Simplify IT operations across your data centers and clouds

Managed services to run your IT operations

HPE GreenLake Management Services provides services that monitor, operate, and optimize your infrastructure and applications, delivered consistently and globally to give you unified control and let you focus on innovation.

HPE Pointnext Tech Care.

HPE Pointnext Tech Care is the new operational service experience for HPE products. Tech Care goes beyond traditional support by providing access to product specific experts, an AI driven digital experience, and general technical guidance to not only reduce risk but constantly search for ways to do things better. HPE Pointnext Tech Care has been reimagined from the ground up to support a customer-centric, AI driven, and digitally enabled customer experience to move your business forward. HPE Pointnext Tech Care is available in three response levels. Basic, which provides 9×5 business hour availability and a 2 hour response time. Essential which provides a 15 minute response time 24×7 for most enterprise level customers, and Critical which includes a 6 hour repair commitment where available and outage management response for severity 1 incidents.

https://www.hpe.com/services/techcare

HPE Pointnext Complete Care

HPE Pointnext Complete Care is a modular, edge-to-cloud IT environment service that provides a holistic approach to optimizing your entire IT environment and achieving agreed upon IT outcomes and business goals through a personalized and customer-centric experience. All delivered by an assigned team of HPE Pointnext Services experts.  HPE Pointnext Complete Care provides:

· A complete coverage approach — edge to cloud

· An assigned HPE team

· Modular and fully personalized engagement

· Enhanced Incident Management experience with priority access

· Digitally enabled and AI driven customer experience

https://www.hpe.com/services/completecare

HPE Server Hardware Installation

Provides for the basic hardware installation of HPE branded servers, storage devices and networking options to assist you in bringing your new hardware into operation in a timely and professional manner.

https://h20195.www2.hpe.com/v2/Getdocument.aspx?docname=5981-9356enw

Provides for the installation of your HPE hardware according to product specifications including options. The HPE service delivery technician will connect the product to a LAN as appropriate and enable remote support to allow for automatic case creation for hardware failures. Installation and start up services also includes the installation of one supported operating system type (Windows® or Linux).

Complete Care for Hyperscale is available for Service Providers and HPC customers who use a scale out approach to computing with a high volume homogenous infrastructure and resilient architecture can take advantage of this environment support tailored to their operating model.

HPE Factory Express offers configuration, customization, integration and deployment services for HPE servers and storage products. Customers can choose how their factory solutions are built, tested, integrated, shipped and deployed.

Factory Express offers service packages for simple configuration, racking, installation, complex configuration and design services as well as individual factory services, such as image loading, asset tagging, and custom packaging. HPE products supported through Factory Express include a wide array of servers and storage: HPE Integrity, HPE ProLiant, HPE Apollo, HPE ProLiant Server Blades, HPE BladeSystem, HPE 9000 servers as well as the MSAxxxx3PAR suite, XP, rackable tape libraries and configurable network switches.

HPE Service Credits offers flexible services and technical skills to meet your changing IT demands. With a menu of service that is tailored to suit your needs, you get additional resources and specialist skills to help you maintain peak performance of your IT. Offered as annual credits, you can plan your budgets while proactively responding to your dynamic business.

Keep your IT staff trained making sure they have the right skills to deliver on your business outcomes. Book on a class today and learn how to get the most from your technology investment. http://www.hpe.com/ww/learn

The HPE Support Center is a personalized online support portal with access to information, tools and experts to support HPE business products. Submit support cases online, chat with HPE experts, access support resources or collaborate with peers.

Learn more http://www.hpe.com/support/hpesc.

The HPE Support Center Mobile App* allows you to resolve issues yourself or quickly connect to an agent for live support. Now, you can get access to personalized IT support anywhere, anytime.

HPE Insight Remote Support and HPE Support Center are available at no additional cost with a HPE warranty, HPE Support Service or HPE contractual support agreement.

Notes: *HPE Support Center Mobile App is subject to local availability.

For more information: http://www.hpe.com/services.

Notes: HPE ProLiant DL385 Gen10 Plus Server is covered under the HPE Service Contract applied to the HPE ProLiant Server. No separate HPE support services need to be purchased.

Warranty and Support Services will extend to include HPE options configured with your server or storage device. The price of support service is not impacted by configuration details. HPE sourced options that are compatible with your product will be covered under your server support at the same level of coverage allowing you to upgrade freely. Installation for HPE options is available as needed. To keep support costs low for everyone, some high value options will require additional support. Additional support is only required on select high value workload accelerators, fibre switches, InfiniBand and UPS batteries over 12KVA. See the specific high value options that require additional support here.

Hewlett Packard Enterprise will provide HPE-supported replacement parts and materials necessary to maintain the covered

hardware product in operating condition, including parts and materials for available and recommended engineering improvements.

Parts and components that have reached their maximum supported lifetime and/or the maximum usage limitations as set forth in the manufacturer’s operating manual, product QuickSpecs, or the technical product data sheet will not be provided, repaired, or

replaced as part of these services.

The defective media retention service feature option applies only to Disk or eligible SSD/Flash Drives replaced by Hewlett Packard Enterprise due to malfunction.

· Hewlett Packard Enterprise does not allow factory integration of options into pre-configured models. Any additional options purchased will not be shipped inside the server.

· If you desire a custom configuration please see the “Configuration Information – Factory Integrated Models” section of this QuickSpecs.

European Union (EU) eco-design regulations for server and storage products, known as Lot 9, go into effect on March 1st, 2020. Among other requirements, for servers this directive establishes power thresholds for idle state, as well as efficiency and performance in active state which vary among configurations. HPE ProLiant Gen10 servers are compliant with Lot 9 requirements. For more information regarding HPE Lot 9 conformance, please visit:

https://www.hpe.com/us/en/about/environment/msds-specs-more/erp-lot9-servers.html

Notes:

­ UEFI is the standard default for all Pre-configured models.

¹Supports Intel Optane Persistent Memory 200 Series, enabling up to 6TB memory per socket (does not work with SGX).

²5315Y 8/6/4 cores would result in 3.2/3.2/3.4 GHz operating points at 140W/125W/115W TDPs.

• B21 = Worldwide
• 291 = Japan
• AA1 = PRC

Notes: The -B21 WW SKU is to be ordered in all countries other than Japan or PRC.

Notes:

­ UEFI is the standard default for all Pre-configured models.

¹4309Y 8/8/8 cores would result in 2.8/2.6/2.3 GHz operating points at 105W/95W/85W TDPs.

To ensure valid configurations are ordered, Hewlett Packard Enterprise recommends the use of an HPE approved configurator. Contact your local sales representative for information on configurable product offerings and requirements.

· Factory Integrated Models must start with a CTO Server.

· FIO indicates that this option is only available as a factory installable option.

· Some options may not be integrated at the factory. Contact your local sales representative for additional information

Network Choice (NC) Models

Network Choice models do not include embedded LOM. To enable networking capability please select a validated alternative NIC    -OCP or PCIe- from the Core Options section.

– *HPE offers multiple Trade Agreement Act (TAA) compliant configurations to meet the needs of US Federal Government customers. These products are either manufactured or substantially transformed in a designated country.

– Intel® Optane Persistent Memory 200 Series is only supported on Platinum, Gold or 4314 processors.

For example: for a single Xeon-Platinum 8380 processor configuration select 1x P36941-B21. If dual Xeon-Platinum 8380

processor configuration, select 2x P36941-B21

Notes:

– Mixing of 2 different processor models is not supported.

– CTO server includes 5 standard fans. Dual processor configurations require 7 fans, either standard or high performance (dependent on processor model).

– Processors with TDP equal to or greater than 150W require High Performance Heatsink (P26479-B21).

– Processors with TDP equal to or greater than 205W require High Performance Fan Kit (P26477-B21).

– Options as NVMe SSDs, 100GbE or greater NICs/HCAs, accelerators, 24G SAS drives -among others- require high performance fans.

– Processors with TDP up to 140W, or starting at 230W -both included- require DIMM blanks kit (P07818-B21).

– DIMM blanks kit (P07818-B21) recommended with processor TDPs ranging from 150W to 225W -both included- as enhance cooling.

– Each processor feeds 2 x8 front NVMe connectors, supporting up to 4 drives. Socket must populated for NVMe connectors to be usable.

– All SKUs below ship with processor only. Adequate fans and heatsinks (standard, or high performance) must be selected.

– 3200 MT/S maximum memory speed unless otherwise noted.

– 64GB SGX Enclave unless otherwise noted.

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– 512GB SGX Enclave.

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– 512GB SGX Enclave.

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– Does not support Intel Speed Select Technology – Base Frequency (SST-BF).

– 36/32/24 cores would result in 2.4/2.5/2.6 GHz operating points at 250W/250W/220W TDPs.

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– 8GB SGX Enclave.

– 32/24/16 cores would result in 2.2/2.3/2.6 GHz operating points at 205W/185W/185W TDPs.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– 36/32/24 cores would result in 2.1/2.0/2.0 GHz operating points at 195W/180W/155W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– 8GB SGX Enclave.

– Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– 32/24/16 cores would result in 2.2/2.3/2.6 GHz operating points 205W/185W/185W TDPs.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 512GB SGX Enclave.

– 32/28/24 cores would result in 2.3/2.4/2.6 GHz operating points 185W/185W/185W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Does not support Intel Speed Select Technology – Base Frequency (SST-BF).

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Single socket capable even though not being a “U” processor. No dual socket support.

– All SKUs below ship with processor only. Adequate fans and heatsinks (standard, or high performance) must be selected.

– 3200 MT/S maximum memory speed unless otherwise noted.

– 64GB SGX Enclave unless otherwise noted.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2677 MT/s max. memory speed.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 24/12/8 cores would result in 2.4/2.9/3.1 GHz operating points at 185W/150W/150W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2667 MT/s max. memory speed.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– 24/24/22 cores would result in 2.1/1.9/2.0 GHz operating points at 165W/150W/150W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– 24/20 cores would result in 2.1/2.0 GHz operating points at 150W/135W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– 24/24/22 cores would result in 2.1/1.9/2.0 GHz operating points at 165W/150W/150W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2667 MT/s max. memory speed.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– 8/6/4 cores would result in 3.2/3.2/3.4 GHz operating points at 140W/125W/115W TDPs.

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– All SKUs below ship with processor only. Adequate fans and heatsinks (standard, or high performance) must be selected.

– 2667 MT/S maximum memory speed.

– 8GB SGX Enclave unless otherwise noted.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires DIMM blanks kit (P07818-B21).

– Supports Intel Optane Persistent Memory 200 Series, enabling up to 6TB memory per socket (does not work with SGX).

– 8/8/8 cores would result in 2.8/2.6/2.3 GHz operating points at 105W/95W/85W TDPs.

– Requires DIMM blanks kit (P07818-B21).

Please select one or more memory DIMMs from below.

For new Gen10 Plus memory population rule whitepaper and optimal memory performance guidelines, please go to:

http://www.hpe.com/docs/memory-population-rules

For Gen10 Plus memory speed table, please go to: https://www.hpe.com/docs/memory-speed-table

For memory Reliability, Accessibility, Serviceability (RAS) features whitepaper like Gen10 Plus Fast Fault Tolerance and legacy mirrored memory feature etc. please go to: http://www.hpe.com/docs/memory-ras-feature.

Notes:

– The maximum memory speed and capacity is a function of the memory type, memory configuration, and processor model.

– Quantity of memory DIMMs selected per socket must be 1, 2, 4, 6, 8, 12 or 16.

– For additional information, please see the HPE DDR4 SmartMemory QuickSpecs

– Requires High Performance Fan Kit (P26477-B21) and DIMM blanks kit (P07818-B21).

–       Support limited to 25°C maximum inlet temperature.

– Not supported with HPE IB HDR/EN 200Gb 2p QSFP56 OCP3 Adapter.

– A maximum of 16 HPE Persistent Memory Kits supported on the following 3^rd Generation Intel Xeon Scalable Processor series (Platinum 8300, Gold 6300 and Silver 4310).

– Supported on quantities of 1, 2, 4 or 8 per socket.

– Cannot be used with HPE 800W FlexSlot 48VDC Hot Plug Low Halogen Power Supply (865434-B21).

– For additional information regarding HPE Persistent Memory Population Rules and Guidelines for Gen10 Plus visit: http://www.hpe.com/docs/memory-population-rules

– Required by processors with TDP up to 140W, or starting at 230W (both included).

– Recommended with processor TDPs ranging from 150W to 225W -both included- as enhance cooling.

Please select one or two power supplies from below.

Notes: Mixing of 2 different power supplies is NOT supported.

If front drives are needed in the 8 SFF server, please select one backplane from list below.

– for all backplanes below:

o Supports Basic Carrier Drives.

o Includes cabling.

– Supports SAS and SATA Basic Carrier (BC) drives.

– UBM2.

– Can’t be connected to Tri-Mode controllers.

– Supports SATA, SAS and NVMe Basic Carrier (BC) drives.

– NVMe SSDs must be U.3.

– Requires High Performance Fan Kit (P26477-B21).

– No NVMe Direct Attach support.

– Not supported with SR932i-p Tri-Mode controller.

– Can’t be connected to Smart Array (SAS/SATA) controllers or embedded SATA ports.

– UBM3.

– Supports SATA, SAS and NVMe Basic Carrier (BC) drives.

– NVMe SSDs must be U.3.

– Requires High Performance Fan Kit (P26477-B21).

– Supports NVMe Direct Access and slotted Tri-Mode controllers.

– Includes Direct Access cables.

– Requires 8 SFF cable (P26451-B21) for Tri-Mode controllers.

– Can’t be connected to Smart Array (SAS/SATA) controllers, nor to embedded SATA ports.

– UBM3.

– Supports NVMe (U.2 and non-static U.3) Basic Carrier (BC) SSDs.

– Requires High Performance Fan Kit (P26477-B21).

– Supports NVMe Direct Access and SR932i-p Tri-Mode controller.

– Includes Direct Access cables.

– Requires 8 SFF cable (P26451-B21) for SR932i-p Tri-Mode controller.

– Does not support HPE Smart Storage SR100i SR Gen10 Plus SW RAID.

– Maximum of 8 U.2 drives per controller.

– Can’t be connected to Smart Array (SAS/SATA) controllers or embedded SATA ports.

– UBM4.

­ Enables Fast Fault Tolerance mode, an HPE Memory RAS feature introduced in HPE Gen10 servers that survives up to two DRAM failures.

­ This RAS feature combines Adaptive Double DRAM Device Correction (ADDC) with HPE Advanced Error Detection Technology, resultin in significantly better memory reliability and availability that what ADDDC provides on its own. For more information see our Memory RAS feature technical whitepaper.

­ Instructs factory to populate 12 DIMMs/socket in the optimal way required by Sub-NUMA Clustering (SNC).

­ Only applicable to 12 DIMM/socket counts.

­ Directs HPE manufacturing site to create, digitally sign and store a platform certificate on the server.

­ Requires HPE Trusted Platform Module (TPM).

­ Firmware first is ProLiant servers BIOS default selection. In this mode monitoring functionality built into the design of the server is first on the scene of correctable problems to determine quickly and accurately what’s wrong and how to fix it. Firmware first enables many platform-specific actions for errors including predictive fault analysis. This technology functions independently of the operating system and does not depend on O/S-based tools.

­ This SKU instructs factories to enable O/S first mode, a BIOS switch that allows experienced customers to have the operating system handle correctable hardware errors. On this mode, more errors could be observed, including soft ones that do not necessarily indicate issues with the component or cause warranty replacement.

Risers

– M.2 media not included, 22110 capable.

– Requires High Performance Fan Kit (P26477-B21).

– This kit is not available on the 4 LFF model.

­ D = Default on server; O = Optional; N = not supported or slot/connector not present.

¹Supports 2x 22110 M.2 media, not included.

²Provides HW RAID 1 capabilities utilizing inbox Windows, Linux or VMware drivers.

³Requires High Performance Fan Kit (P26477-B21).

⁴Not supported on 4 LFF models.

⁵When secondary full height kit is installed, then primary PCIe Slot #2 cannot be used. Only 2 full height slots are supported.

⁶GPU max 75W

⁷Slot 1 only, no slot 2 support

­ *For additional details on ProLiant DL Gen10 Plus server risers. Please visit:

https://www.hpe.com/h20195/v2/Getdocument.aspx?docname=a00043229enw

– Includes 2 fans, complements base server default (5) to system max. of 7 required by 2P configs.

– Supports processors with a TDP equal or lower than 195W.

– Includes 7 fans, required by processors with a TDP equal or greater than 205W, and select options.

– Required for Extended Ambient Operating Support.

– Instructs factory to install blanks on unused DIMM slots. Max. 1 kit per system.

– Required by processors with TDP up to 140W, or starting at 230W (both included).

– Recommended with processor TDPs ranging from 150W to 225W -both included- as enhance cooling.

Notes:

– ¹Both minimum and maximum limits included (e.g greater or equal to, and up to including).

– ²CPU TDP driven. Options as NVMe SSDs, 100GbE or greater NICs/HCAs, accelerators or 24G SAS drives -among others- require high performance fans.

– ³Recommended with processor TDPs ranging from 185W to 225W -both included- as enhance cooling.

– ⁴Required.

– Supports SAS and SATA Basic Carrier (BC) Drives.

– Requires an 8 SFF backplane (12G x1 SAS/SATA, 24G Tri-Mode, or 16G x4 NVMe).

– Includes cabling.

– Can’t be connected to Tri-Mode controllers.

– UBM2.

– Supports SAS, SATA and NVMe Basic Carrier (BC) Drives.

– Requires an 8 SFF backplane (12G x1 SAS/SATA, 24G x1 Tri-Mode or 24G x4 Tri-Mode).

– Cannot be mixed with 8SFF 16G x4 NVMe U.2 backplane (P26433-B21).

– Includes Direct Access cables.

– NVMe SSDs must be U.3.

– Requires High Performance Fan Kit (P26477-B21).

– Supports NVMe Direct Access and Tri-Mode controllers.

– Requires 2 SFF cable (P36657-B21) for Tri-Mode controllers.

– Can’t be connected to Smart Array (SAS/SATA) controllers or embedded SATA ports.

– UBM3.

– Supports NVMe (U.2 and non-static U.3) Basic Carrier (BC) SSDs.

– Requires an 8 SFF backplane (12G x1 SAS/SATA or 16G x4 NVMe).

– Cannot be mixed with U.3 backplanes (P26429-B21 or P26431-B21).

– Includes Direct Access cables

– Requires High Performance Fan Kit  (P26477-B21).

– Supports NVMe Direct Access and Tri-Mode controllers.

– Requires 2 SFF cable (P36657-B21) for Tri-Mode controllers.

– Drive hot-plug functionality not supported when managed by SR100i SW RAID.

– UBM4.

– Requires Universal Media Bay Kit (P40003-B21) to install on 8 SFF models.

– Requires cable for optical drive (P26459-B21) to install on 4 LFF models.

– Requires Universal Media Bay Kit (P40003-B21) to install on 8 SFF models.

– Requires cable for optical drive (P26459-B21) to install on 4 LFF models.

Please select one or two matching processors.

For example: for a single Xeon-Platinum 8380 processor configuration select 1x P36941-B21. If dual Xeon-Platinum 8380

processor configuration, select 2x P36941-B21

Notes:

­ Mixing of 2 different processor models is not supported.

­ CTO server includes 5 standard fans. Dual processor configurations require 7 fans, either standard or high performance (dependent on processor model).

­ Processors with TDP equal to or greater than 150W require High Performance Heatsink (P26479-B21).

­ Processors with TDP equal to or greater than 205W require High Performance Fan Kit (P26477-B21).

­ Options as NVMe SSDs, 100GbE or greater NICs/HCAs, accelerators, 24G SAS drives -among others- require high performance fans.

­ Processors with TDP up to 140W, or starting at 230W -both included- require DIMM blanks kit (P07818-B21).

­ DIMM blanks kit (P07818-B21) recommended with processor TDPs ranging from 185W to 225W -both included- as enhance cooling.

­ Each processor feeds 2 x8 front NVMe connectors, supporting up to 4 drives. Socket must populated for NVMe connectors to be usable.

– All SKUs below ship with processor only. Adequate fans and heatsinks (standard, or high performance) must be selected.

– 3200 MT/S maximum memory speed unless otherwise noted.

– 64GB SGX Enclave unless otherwise noted.

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– 512GB SGX Enclave.

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– 512GB SGX Enclave.

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– Does not support Intel Speed Select Technology – Base Frequency (SST-BF).

– 36/32/24 cores would result in 2.4/2.5/2.6 GHz operating points at 250W/250W/220W TDPs.

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– Requires High Performance Heatsink (P26479-B21), Fans (P26477-B21) and DIMM blanks kit (P07818-B21).

– 8GB SGX Enclave.

– 32/24/16 cores would result in 2.2/2.3/2.6 GHz operating points at 205W/185W/185W TDPs.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– 36/32/24 cores would result in 2.1/2.0/2.0 GHz operating points at 195W/180W/155W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– 8GB SGX Enclave.

– Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– 32/24/16 cores would result in 2.2/2.3/2.6 GHz operating points 205W/185W/185W TDPs.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 512GB SGX Enclave.

– 32/28/24 cores would result in 2.3/2.4/2.6 GHz operating points 185W/185W/185W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Does not support Intel Speed Select Technology – Base Frequency (SST-BF).

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Single socket capable even though not being a “U” processor. No dual socket support.

– All SKUs below ship with processor only. Adequate fans and heatsinks (standard, or high performance) must be selected.

– 3200 MT/S maximum memory speed unless otherwise noted.

– 64GB SGX Enclave unless otherwise noted.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2677 MT/s max. memory speed.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 24/12/8 cores would result in 2.4/2.9/3.1 GHz operating points at 185W/150W/150W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2667 MT/s max. memory speed.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21) and Fans (P26477-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– 24/24/22 cores would result in 2.1/1.9/2.0 GHz operating points at 165W/150W/150W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– 24/20 cores would result in 2.1/2.0 GHz operating points at 150W/135W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– Supports Intel® Speed Select Performance Profile (SST-P), even though not being a “Y” processor.

– 24/24/22 cores would result in 2.1/1.9/2.0 GHz operating points at 165W/150W/150W TDPs.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2667 MT/s max. memory speed.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– 8/6/4 cores would result in 3.2/3.2/3.4 GHz operating points at 140W/125W/115W TDPs.

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– 2933 MT/s max. memory speed.

– All SKUs below ship with processor only. Adequate fans and heatsinks (standard, or high performance) must be selected.

– 2667 MT/S maximum memory speed.

– 8GB SGX Enclave unless otherwise noted.

– Requires High Performance Heatsink (P26479-B21).

– DIMM blanks kit (P07818-B21) recommended as enhance cooling.

– Requires DIMM blanks kit (P07818-B21).

– Supports Intel Optane Persistent Memory 200 Series, enabling up to 6TB memory per socket (does not work with SGX).

– 8/8/8 cores would result in 2.8/2.6/2.3 GHz operating points at 105W/95W/85W TDPs.

– Requires DIMM blanks kit (P07818-B21).

Please select one or more memory DIMMs from below.

For new Gen10 Plus memory population rule whitepaper and optimal memory performance guidelines, please go to:

http://www.hpe.com/docs/memory-population-rules

For Gen10 Plus memory speed table, please go to: https://www.hpe.com/docs/memory-speed-table

For memory Reliability, Accessibility, Serviceability (RAS) features whitepaper like Gen10 Plus Fast Fault Tolerance and legacy mirrored memory feature etc. please go to: http://www.hpe.com/docs/memory-ras-feature.

Notes:

– The maximum memory speed and capacity is a function of the memory type, memory configuration, and processor model.

– Quantity of memory DIMMs selected per socket must be 1, 2, 4, 6, 8, 12 or 16.

– For additional information, please see the HPE DDR4 SmartMemory QuickSpecs

– Requires DIMM blanks kit (P07818-B21).

– Support limited to 25°C maximum inlet temperature.

– Not supported with HPE IB HDR/EN 200Gb 2p QSFP56 OCP3 Adapter.

– A maximum of 8 HPE Persistent Memory Kits per socket are supported on the following 3^rd Generation Intel Xeon Scalable Processor series (Platinum 8300, Gold 6300 or 4314).

– Supported on quantities of 1, 2, 4 or 8 per socket.

– Cannot be used with HPE 800W FlexSlot 48VDC Hot Plug Low Halogen Power Supply (865434-B21).

– For additional information regarding HPE Persistent Memory Population Rules and Guidelines for Gen10 Plus visit: http://www.hpe.com/docs/memory-population-rules

– Kit includes enough blanks for one server.

– Required by processors with TDP up to 140W, or starting at 230W (both included).

– Recommended with processor TDPs ranging from 185W to 225W -both included- as enhance cooling.

HPE MegaRAID Storage Controllers and HPE SmartRAID Storage Controllers

– For all cards below:

o SR series and MR series Tri Mode controllers cannot be mixed in same configuration.

o If selected along a 2 SFF x4 U.3 or x4 U.2 backplane, the 2 SFF Tri-Mode Cable (P36657-B21) is required

o Cannot be used in conjunction with the OCP x16 Enablement Kit (P36661-B21) or the Smart Array-NVMe Adapter Kit (P38585-B21).

– Provides x8 PCIe 4.0 lanes to a 2SFF NVMe cage, recovering from unused AROC connector on configurations without  Flexible Storage controllers.

– Cannot be used in conjunction with the OCP x16 Enablement kit, NVMe riser, or Flexible Storage Controllers.

– This kit is not available on the 4 LFF model.

– Not supported on slot 3.

– Requires internal cable kit (SFF: P26449-B21 / LFF: P26461-B21) if installed in slot 2.

– Not supported on slot 3.

– Requires internal cable kit (SFF: P26449-B21 / LFF: P26461-B21) if installed in slot 2.

– For all cards below:

o Only supported on slot 1.

o SR series and MR series Tri Mode controllers cannot be mixed in a same configuration.

o If selected along an 8 SFF U.3 or U.2 backplane, the 8 SFF Tri-Mode Cable (P26451-B21) is required.

o If selected along an 2 SFF U.3 or U.2 backplane, the 2 SFF Tri-Mode Cable (P36657-B21) may be required.

– When used in conjunction with the Smart Hybrid Capacitor (P02377-B21), additional 4xx or 8xx storage controllers will be limited to a maximum of one. If more than two controllers are needed on the server, the Smart Storage battery (P01366-B21) must be used.

– Requires UEFI, not supported on Legacy Mode.

– Maximum of 2 NVMe SSDs, which must be connected to NVMe ports embedded on system board.

– Does not support hot-plug functionality on the 2SFF NVMe U.2 (UBM4) backplane.

– Requires UEFI, not supported on Legacy Mode.

– Supported only with NVMe U.2 P4xxx SSDs.

– For NVMe SSDs only, no PCIe card support.

– Can’t be selected along Factory RAID settings.

– Requires UEFI, not supported on Legacy Mode.

– For NVMe SSDs only, no PCIe card support.

– Can’t be selected along Factory RAID settings.

– Requires UEFI, not supported on Legacy Mode.

– Supported only with NVMe U.2 P4xxx SSDs.

– For NVMe SSDs only, no PCIe card support.

– Similar to Intel VROC NVMe FIO SW for HPE (R7J58A), but intended for field deployments (BTO).

­ Requires UEFI, not supported on Legacy Mode.

­ For NVMe SSDs only, no PCIe card support.

­ Similar to Intel VROC NVMe Premium FIO SW for HPE (R7J57A), but intended for field deployments (BTO).

­ Can only be selected with U.3 backplane/cage and requires choice of either MR416i-a, MR216i-a, MR416i-p or MR216i-p Tri-Mode controller.

­ Local Key Management handled by controller.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ Can only be selected with U.3 backplane/cage and requires choice of either MR416i-a, MR216i-a, MR416i-p or MR216i-p Tri-Mode controller.

­ Local Key Management handled by controller.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

For SSD selection guidance, please visit https://ssd.hpe.com/

­ SED capability requires choice of either MR416i-a, MR416i-p, MR216i-a or MR216i-p Tri-Mode controller and will run at 12G speeds.

­ Local Key Management handled by controller.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ SED capability requires choice of either MR416i-a, MR416i-p, MR216i-a or MR216i-p Tri-Mode controller and will run at 12G speeds.

­ Local Key Management handled by controller.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ SED capability requires choice of either MR416i-a, MR416i-p, MR216i-a or MR216i-p Tri-Mode controller and will run at 12G speeds.

­ Local Key Management handled by controller.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ SED capability requires choice of either MR416i-a, MR416i-p, MR216i-a or MR216i-p Tri-Mode controller and will run at 12G speeds.

­ Local Key Management handled by controller.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ Cannot be used with either SR932i-p  or SR416i-a Tri-Mode controllers.

­ Cannot be used with SR100i SW RAID.

­ Cannot be used with either SR932i-p  or SR416i-a Tri-Mode controllers.

­ Cannot be used with SR100i SW RAID.

­ Can only be selected with U.3 backplane/cage.

­ For controller attached:

o  Requires choice of either MR416i-a, MR216i-a, MR416i-p or MR216i-p Tri-Mode controller.

o  Local Key Management handled by controller.

­ For direct attach:

o  Cannot be used with SR100i SW RAID.

o  Requires TPM 2.0 for Local Key encryption.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ Cannot be used with either SR932i-p  or SR416i-a Tri-Mode controllers.

­ Cannot be used with SR100i SW RAID.

­ Can only be selected with U.3 backplane/cage.

­ For controller attached:

o  Requires choice of either MR416i-a, MR216i-a, MR416i-p or MR216i-p Tri-Mode controller.

o  Local Key Management handled by controller.

­ For direct attach:

o Cannot be used with SR100i SW RAID.

o Requires TPM 2.0 for Local Key encryption.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ Cannot be used with either SR932i-p  or SR416i-a Tri-Mode controllers.

­ Cannot be used with SR100i SW RAID.

– All NVMe drives require the High Performance Fan Kit (P26477-B21).

– U.3 Static drives can only be used with U.3 cages/backplanes.

­ Cannot be used with either SR932i-p  or SR416i-a Tri-Mode controllers.

­ Cannot be used with SR100i SW RAID.

­ Cannot be used with either SR932i-p  or SR416i-a Tri-Mode controllers.

­ Cannot be used with SR100i SW RAID.

­ Can only be selected with U.3 backplane/cage.

­ For controller attached:

o Requires choice of either MR416i-a, MR216i-a, MR416i-p or MR216i-p Tri-Mode controller.

o Local Key Management handled by controller.

­ For direct attach:

o Cannot be used with SR100i SW RAID.

o Requires TPM 2.0 for Local Key encryption.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ Cannot be used with either SR932i-p  or SR416i-a Tri-Mode controllers.

­ Cannot be used with SR100i SW RAID.

­ Can only be selected with U.3 backplane/cage.

­ For controller attached:

o Requires choice of either MR416i-a, MR216i-a, MR416i-p or MR216i-p Tri-Mode controller.

o Local Key Management handled by controller.

­ For direct attach:

o Cannot be used with SR100i SW RAID.

o Requires TPM 2.0 for Local Key encryption.

­ iLO Advanced required for SED connectivity into customer’s Remote Key Management environment.

­ Cannot be used with either SR932i-p  or SR416i-a Tri-Mode controllers.

­ Cannot be used with SR100i SW RAID.

– All NVMe drives require the High Performance Fan Kit (P26477-B21).

– U.3 Static drives can only be used with U.3 cages/backplanes.

– All NVMe drives require the High Performance Fan Kit (P26477-B21).

– U.2 drives Cannot be used with SR100i SW RAID.

– U.2 drives can only function at x4 bandwidth, doesn’t support x2 or x1 connectivity.

– All NVMe drives require the High Performance Fan Kit (P26477-B21).

– U.2 drives Cannot be used with SR100i SW RAID.

– U.2 drives can only function at x4 bandwidth, doesn’t support x2 or x1 connectivity.

– All NVMe drives require the High Performance Fan Kit (P26477-B21).

– U.2 drives Cannot be used with SR100i SW RAID.

– U.2 drives can only function at x4 bandwidth, doesn’t support x2 or x1 connectivity.

­ Requires DL36X x16/x8 M.2 NS204i-r Primary Riser (P26463-B21).

­ Quantity 2 needed by M.2 NS204i-r Riser.

­ Requires High Performance Fan Kit (P26477-B21).

– Requires UEFI, not supported on Legacy Mode.

– Requires the High Performance Fan Kit (P26477-B21).

– Each card instance requires one RTU license of Silver or Platinum software. In case of more than one adapter, RTU licenses doesn’t need to be of the same part number.

o One 3yr/4yr/5yr license must be purchased for every DSC-25 or DSC-100 card in a server.

o 1yr licenses are reserved for renewals only.

­ Cannot be installed on slot #2.

­ Can be used to fulfill factory diagnostics requirements.

­ All of the following cards require the High Performance Fan Kit (P26477-B21).

­ All cards below limited to 30°C maximum inlet temperature.

­ None of the cards below support PXE Boot.

­ Unless otherwise stated, all cards below can be used to fulfill factory diagnostics requirements.

­ Can be used to fulfill factory diagnostics requirements.

­ Requires the High Performance Fan Kit (P26477-B21).

­ Support limited to 30°C maximum inlet temperature.

­ Must add x16 OCP enablement kit (P36661-B21) if NIC x16 connectivity desired.

­ Requires the High Performance Fan Kit (P26477-B21).

­ Requires High Performance Fan Kit (P26477-B21).

­ High Performance Fan Kit (P26477-B21) required for inlet temperatures above 28°C.

­ Must add x16 OCP enablement kit (P36661-B21) if NIC x16 connectivity desired.

­ Requires High Performance Fan Kit (P26477-B21).

­ Requires OCP x16 Enablement kit (P36661-B21).

­ 30°C maximum inlet temperature.

­ Requires High Performance Fan Kit (P26477-B21).

­ Requires OCP x16 Enablement kit (P36661-B21).

­ Temperature limit of 30°C inlet, except when using the latest generation of AOCs (P28169-B2x), where the limit is 27°C inlet.

­ Cannot be used to fulfill factory diagnostics requirements, select an alternate NIC.

­ Requires High Performance Fan Kit (P26477-B21).

­ Requires OCP x16 Enablement kit (P36661-B21).

­ The maximum inlet temperature can be 25°C, without using the newest generation of AOCs (P28169-B2x), which would make the configuration unsupported.

­ Not supported with 256GB LR DIMMs

­ Limits NVMe SSDs to a maximum of 8.

­ Cannot be used to fulfill factory diagnostics requirements, select an alternate NIC.

­ Adds x8 PCIe 4.0 lanes to OCP slot, recovering from unused AROC connector on configurations without  Flexible Storage controllers.

­ Cannot be used in conjunction with any the Smart Array-NVMe Adapter Kit (P38585-B21) or any Flexible Storage Controller.

­ Requires High Performance Fan Kit (P26477-B21).

­ Temperature limit of 30°C inlet, except when using the latest generation of AOCs (P28169-B2x), where the limit is 27°C inlet.

­ None of the cards below can be used to fulfill factory diagnostics requirements, select an alternate NIC.

­ Requires High Performance Fan Kit (P26477-B21).

­ 30°C maximum inlet temperature.

HPE Flexible Slot (Flex Slot) Power Supplies share a common electrical and physical design that allows for hot plug, tool-less installation into HPE ProLiant Gen10 Plus Performance Servers. Flex Slot power supplies are certified for high-efficiency operation and offer multiple power output options, allowing users to “right-size” a power supply for specific server configurations. This flexibility helps to reduce power waste, lower overall energy costs, and avoid “trapped” power capacity in the data center.

All pre-configured servers ship with a standard 6-foot IEC C-13/C-14 jumper cord (A0K02A). This jumper cord is also included with each standard AC power supply option kit. If a different power cord is required, please check the ProLiant Power Cables web page.

To review the power requirements for your selected system, please use the HPE Power Advisor Tool.

For information on power specifications and technical content visit HPE Server power supplies.

– Requires High Performance Fan Kit (P26477-B21).

– When this accelerator is installed in a secondary riser, server cannot be shipped integrated into a rack.

– Requires increased cooling to be selected in BIOS settings

– There is no Energy Star certification with Graphic cards.

– ¹ Requires high performance fans

– ² When installed in a secondary riser, accelerator will be fulfilled as ship along, can’t be racked by factory.

– Replaces iLO default randomized password by an HPE defined common password. HPE highly recommends changing this password immediately after the initial onboarding process.

– Customers who want to choose their own custom iLO default password should use the HPE Factory Express Integration Services.

HPE OneView Advanced (with HPE iLO Advanced)

– Licenses ship without media. The HPE OneView Media Kit can be ordered separately, or can be downloaded at: https://www.hpe.com/us/en/integrated-systems/software.html

– Electronic and Flexible-Quantity licenses can be used to purchase multiple licenses with a single activation key.

– Licenses ship without media. The HPE OneView Media Kit can be ordered separately, or can be downloaded at: https://www.hpe.com/us/en/integrated-systems/software.html

– HPE Trusted Platform Module 2.0 option works with Gen10 Plus servers with UEFI Mode not Legacy Mode. It is not compatible with HPE ProLiant Gen10 or earlier servers.

– HPE server systems can have a TPM module (of any type) installed only once. It cannot be replaced with any other TPM module.

Rail Kits

– HPE rail kits contain telescoping rails which allow for in-rack serviceability.

– Hewlett Packard Enterprise recommends that a minimum of two people are required for all Rack Server installations.

Please refer to your installation instructions for proper tools and number of people to use for any installation.

· Please see the HPE Advanced Series Racks QuickSpecs for information on additional racks options and rack specifications.

· Please see the HPE Enterprise Series Racks QuickSpecs for information on additional racks options and rack specifications.

· Please see the HPE Basic Power Distribution Units (PDU) QuickSpecs for information on these products and their specifications.

· Please see the HPE Metered Power Distribution Units (PDU) QuickSpecs for information on these products and their specifications. Please see the HPE Intelligent Power Distribution Unit (PDU) QuickSpecs for information on these products and their specifications.

· Please see the HPE Metered and Switched Power Distribution Units (PDU) QuickSpecs for information on these products and their specifications.

· To learn more, please visit the HPE Uninterruptible Power Systems (UPS) web page.

· Please see the HPE DirectFlow Three Phase Uninterruptible Power System QuickSpecs for information on these products and their specifications.

· Please see the HPE Line Interactive Single Phase UPS QuickSpecs for information on these products and their specifications.

SD Card/USB media can still be used as a standalone boot option through all 7.x releases via published Customer Advisory Usage of SD Card/USB Devices As Standalone Boot Devices Has Changed Due to System Storage Changes For VMware ESXi 7.0 (Or Later).

For any major release beyond VMware ESXi 7.x, VMware will require M.2 or another local persistent device as the standalone boot option.

HPE Enterprise Mainstream Flash Media Kits for Memory Cards

Installation & Start-up Services

– Ommited DIMM counts/socket not qualified by Intel.

– ¹ Required by Sub-NUMA Cluster (SNC) configurations, must be ordered with 12 DIMM SNC2 FIO Enable Kit (P26933-B21).

· Install DIMMs only if the corresponding processor is installed.

· If only one processor is installed in a two-processor system, only half of the DIMM slots are available.

· To maximize performance, it is recommended to balance the total memory capacity between all installed processors.

· When two processors are installed, balance the DIMMs across the two processors.

· White DIMM slots denote the first slot to be populated in a channel.

· Mixing of DIMM types (UDIMM, RDIMM, and LRDIMM) is not supported.

· The maximum memory speed is a function of the memory type, memory configuration, and processor model.

· The maximum memory capacity is a function of the number of DIMM slots on the platform, the largest DIMM capacity qualified on the platform, the number and model of installed processors qualified on the platform.

· For details on the HPE Server Memory Options Population Rules, visit:

http://www.hpe.com/docs/memory-population-rules

· To realize the performance memory capabilities listed in this document, HPE DDR4 SmartMemory is required. For additional information, please see the HPE DDR4 SmartMemory QuickSpecs.

Notes: The maximum memory speed is a function of the memory type, memory configuration, and processor model.

For details on the HPE Server Memory speed, visit: https://www.hpe.com/docs/memory-speed-table

Dimensions  (Height x Width x Depth)

SFF Drives

· 4.29 x 43.46 x 74.19 cm

1.69 x 17.11 x 29.21 in

LFF Drives

· 4.29 x 43.46 x 77.31 cm

1.69 x 17.11 x 30.44 in

· 13.29 kg (29.29 lb)

– SFF minimum: One drive, one processor, one power supply, two heatsinks, one Smart Array controller, and five fans.

· 18.11 kg (39.92 lb)

– SFF maximum: 10 drives, two processors, two power supplies, two heatsinks, one Smart Array controller and seven fans.

· 15.09 kg (33.27 lb)

– LFF minimum: one drive, one processor, one power supply, two heatsinks, one Smart Array controller and five fans.

· 19.45 kg (42.88 lb)

– LFF maximum: Four drives, two processors, two power supplies, two heatsinks, one Smart Array controller and seven fans.

Rated Line Voltage

· For 1600W (Platinum): 200-240 VAC

· For 800W (Titanium): 200-240 VAC

· For 800W (Platinum): 100-240 VAC

· For 800W (Universal): 200-277 VAC

· For 800W (-48VDC): -40 Vdc to -72 Vdc

· 500W (Platinum): 100-240 VAC

Maximum

· For 1600W Power Supply: 5918 BTU/hr (at 200 VAC), 5888 BTU/hr (at 220 VAC), 5884 BTU/hr (at 240 VAC)

· For 800W (Titanium) Power Supply: 2905 BTU/hr (at 200 VAC), 2899 BTU/hr (at 220 VAC), 2893 BTU/hr (at 240 VAC)

· For 800W (Platium) Power Supply: 3067 BTU/hr (at 100 VAC), 2958 BTU/hr (at 200 VAC), 2949 BTU/hr (at 240 VAC)

· For 800W (Universal) Power Supply: 2964 BTU/hr (at 200 VAC), 2951 BTU/hr (at 230 VAC), 2936 BTU/hr (at 277 VAC)

· For 800W-(48Vdc) Power Supply: 2983 BTU/hr (at -40 Vdc), 2951 BTU/hr (at -48VDC), 2912 BTU/hr (at -72Vdc)

· For 500W (Platinum) Power Supply: 1902 BTU/hr (at 100 VAC), 1840 BTU/hr (at 200 VAC), 1832 BTU/hr (at 240 VAC)

Rated Steady-State Power

· For 1600W (Titanium) Power Supply: 1600W (at 240 VAC), 1600W (at 240 VDC) for China only

· For 800W (Titanium) Power Supply: 800W (at 200 VAC), 800W (at 240 VAC), 800W (at 240 VDC) for China only

· For 800W (Platinum) Power Supply: 800W (at 100 VAC), 800W (at 240 VAC), 800W (at 240 VDC) input for China only

· For 800W (Universal) Power Supply: 800W (at 200 VAC), 800W (at 277 VAC)

· For 800W (-48VDC) Power Supply: 800W (at -40 Vdc), 800W (at -72Vdc)

· For 500W (Platinum) Power Supply: 500W (at 100 VAC), 500W (at 240 VAC), 500W (at 240 VDC) input for China only

Maximum Peak Power

· For 1600W (Titanium) Power Supply: 1600W (at 240 VAC), 1600W (at 240 VDC) for China only

· For 800W (Titanium) Power Supply: 800W (at 200 VAC), 800W (at 240 VAC), 800W (at 240 VDC) for China only

· For 800W (Platinum) Power Supply: 800W (at 100 VAC), 800W (at 240 VAC), 800W (at 240 VDC) input for China only

· For 800W (Universal) Power Supply: 800W (at 200 VAC), 800W (at 277 VAC)

· For 800W (-48VDC) Power Supply: 800W (at -40 Vdc), 800W (at -72Vdc)

· For 500W (Platinum) Power Supply: 500W (at 100 VAC), 500W (at 240 VAC), 500W (at 240 VDC) input for China only

· Standard Operating Support

10° to 35°C (50° to 95°F) at sea level with an altitude derating of 1.0°C per every 305 m (1.8°F per every 1000 ft) above sea level to a maximum of 3050 m (10,000 ft), no direct sustained sunlight. Maximum rate of change is 10°C/hr (18°F/hr). The upper limit and rate of change may be limited by the type and number of options installed.

System performance during standard operating support may be reduced if operating with a fan fault or above 30°C (86°F).

For approved hardware configurations, the supported system inlet range is extended to be: 5° to 10°C (41° to 50°F) and 35° to 40°C (95° to 104°F) at sea level with an altitude derating of 1.0°C per every 175 m (1.8°F per every 574 ft) above 900 m (2953 ft) to a maximum of 3050 m (10,000 ft). The approved hardware configurations for this system are listed at the URL: http://www.hpe.com/servers/ashrae

· Extended Ambient  Operating Support

For approved hardware configurations, the supported system inlet range is extended to be: 40° to 45°C (104° to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F per every 410 ft) above 900 m (2953 ft) to a maximum of 3050 m (10,000 ft). The approved hardware configurations for this system require the High Performance Fan Kit (P26477-B21) and are listed at the URL: http://www.hpe.com/servers/ashrae

System performance may be reduced if operating in the extended ambient operating range or with a fan fault.

· Non-operating

-30° to 60°C (-22° to 140°F). Maximum rate of change is 20°C/hr (36°F/hr).

· Operating

10% to 90% – Relative humidity (Rh), 28°C maximum wet bulb temperature, non-condensing.

· Non-operating

5 to 95% relative humidity (Rh), 38.7°C (101.7°F) maximum wet bulb temperature, non-condensing.

· Operating

3050 m (10,000 ft). This value may be limited by the type and number of options installed. Maximum allowable altitude change rate is 457 m/min (1500 ft/min).

· Non-operating

9144 m (30,000 ft). Maximum allowable altitude change rate is 457 m/min (1500 ft/min).

To view the regulatory information for your product, view the Safety and Compliance Information for Server, Storage, Power, Networking, and Rack Products, available at the Hewlett Packard Enterprise Support Center:

http://www.hpe.com/support/Safety-Compliance-EnterpriseProducts

For latest information on HPE Smart Array Gen10 Plus Controllers for HPE ProLiant DL, ML and Apollo Servers please refer to their QuickSpecs.

Listed are the declared A-Weighted sound power levels (LWAd) and declared average bystander position A-Weighted sound pressure levels (LpAm) when the product is operating in a 23°C ambient environment. Noise emissions were measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). The listed sound levels apply to standard shipping configurations. Additional options may result in increased sound levels. Please have your HPE representative provide information from the HPE EMESC website for further technical details regarding the configurations listed below.

Notes: Acoustics levels presented here are generated by the test configuration only. Acoustics levels will vary depending on system configuration. Values are subject to change without notification and are for reference only.

Hewlett Packard Enterprise offers end-of-life product return, trade-in, and recycling programs, in many geographic areas, for our products. Products returned to Hewlett Packard Enterprise will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard Enterprise web site. These instructions may be used by recyclers and other WEEE treatment facilities as well as Hewlett Packard Enterprise OEM customers who integrate and re-sell Hewlett Packard Enterprise equipment.